3 thoughts on “What are the advantages and disadvantages of aluminum substrates?”
Tom
The advantages and disadvantages of aluminum substrates are as follows: The advantages of aluminum substrate: 1, meet ROHS requirements;
2. More adaptation to SMT process; . In circuit design In the scheme, the heat diffusion is extremely effective, thereby reducing the module's operating temperature, extending the service life, and increasing power density and reliability; . Reduce the assembly of the radiator and other hardware (including thermal interface materials), shrink to reduce Product volume, reduce hardware and assembly costs; 4. Most optimized combination of power circuit and control circuit; 5. Replace fragile ceramic substrates to obtain better mechanical durability. The disadvantages of aluminum substrates: 1. The cost is higher. 2 The mainstream on the mainstream can only be used as a single panel, and it is difficult to do double -panel technology. 3 Make products is more likely to have problems in terms of electrical strength and pressure resistance.
Aluminum substrate (metal radiator plate (containing aluminum substrate, copper-based plate, iron-based plate)) is a low alloy Al-MG-SI series high-plastic alloy plate (see the figure below). It has good thermal conductivity, electrical insulation insulation Performance and mechanical processing performance. Compared with the traditional FR -4, the aluminum substrate uses the same thickness and the same wire width. The aluminum substrate can carry higher current. The industry is mainly aluminum substrate. ● Using surface stickers (SMT); ● In the circuit design scheme, the thermal diffusion is extremely effective; ● Reduce product operating temperature, improve product power density and reliability and reliability , Extend the service life of the product; ● Reduce the volume of the product and reduce the cost of hardware and assembly; ● Instead of fragile ceramic substrates to obtain better mechanical durability. Structure The aluminum -based copper plate is a metal line board material, consisting of copper foil, thermal conductivity insulation layer and metal substrate. Its structure is divided into three layers: Cireuitl.layer line layer: equivalent to ordinary PCB Copper cover, line copper foil thickness loz to 10oz. The insulation layer: Insulation layer is a layer of low thermal resistance thermal insulation material. The thickness is: 0.003 "to 0.006" inch is the core technology of aluminum -based copper plates, and has obtained UL certification. Baselayer grassroots: is a metal substrate, usually aluminum or chosen copper. Aluminum -based copper plates and traditional epoxy glass layer pressure plates. PCB materials have an unparalleled advantage of other materials. Suitable for power component surface stickers SMT public art. does not need a radiator, the volume is greatly reduced, the heat dissipation effect is excellent, and the good insulation performance and mechanical performance.
Advantages of aluminum substrate: 1 The advantages of heat dissipation 2 Best strength Disadvantages: 1 High cost 2 The mainstream on the mainstream can only do single -panels. Essence 3 Make products is more likely to have problems in terms of electrical strength and pressure resistance.
The advantages and disadvantages of aluminum substrates are as follows:
The advantages of aluminum substrate:
1, meet ROHS requirements;
2. More adaptation to SMT process;
. In circuit design In the scheme, the heat diffusion is extremely effective, thereby reducing the module's operating temperature, extending the service life, and increasing power density and reliability;
. Reduce the assembly of the radiator and other hardware (including thermal interface materials), shrink to reduce Product volume, reduce hardware and assembly costs;
4. Most optimized combination of power circuit and control circuit;
5. Replace fragile ceramic substrates to obtain better mechanical durability.
The disadvantages of aluminum substrates:
1. The cost is higher.
2 The mainstream on the mainstream can only be used as a single panel, and it is difficult to do double -panel technology.
3 Make products is more likely to have problems in terms of electrical strength and pressure resistance.
Aluminum substrate (metal radiator plate (containing aluminum substrate, copper-based plate, iron-based plate)) is a low alloy Al-MG-SI series high-plastic alloy plate (see the figure below). It has good thermal conductivity, electrical insulation insulation Performance and mechanical processing performance. Compared with the traditional FR -4, the aluminum substrate uses the same thickness and the same wire width. The aluminum substrate can carry higher current. The industry is mainly aluminum substrate.
● Using surface stickers (SMT);
● In the circuit design scheme, the thermal diffusion is extremely effective;
● Reduce product operating temperature, improve product power density and reliability and reliability , Extend the service life of the product;
● Reduce the volume of the product and reduce the cost of hardware and assembly;
● Instead of fragile ceramic substrates to obtain better mechanical durability. Structure
The aluminum -based copper plate is a metal line board material, consisting of copper foil, thermal conductivity insulation layer and metal substrate. Its structure is divided into three layers:
Cireuitl.layer line layer: equivalent to ordinary PCB Copper cover, line copper foil thickness loz to 10oz.
The insulation layer: Insulation layer is a layer of low thermal resistance thermal insulation material. The thickness is: 0.003 "to 0.006" inch is the core technology of aluminum -based copper plates, and has obtained UL certification. Baselayer grassroots: is a metal substrate, usually aluminum or chosen copper. Aluminum -based copper plates and traditional epoxy glass layer pressure plates.
PCB materials have an unparalleled advantage of other materials. Suitable for power component surface stickers SMT public art.
does not need a radiator, the volume is greatly reduced, the heat dissipation effect is excellent, and the good insulation performance and mechanical performance.
Advantages of aluminum substrate:
1 The advantages of heat dissipation
2 Best strength
Disadvantages:
1 High cost
2 The mainstream on the mainstream can only do single -panels. Essence
3 Make products is more likely to have problems in terms of electrical strength and pressure resistance.